X3


- Design in accordance with the JEDEC standard;
- New architecture of DDR4 and new technical solution to reduce power consumption by 30% and improve speed by 1.7 times;
- Architecture of Point to Point Topology to improve efficiency of data transmission;
- Bank Group to greatly increase the memory speed;
- Write CRC to greatly increase the read/write reliability of data;
- PPR separated programming operation to support on-line correction of address lines;
- FGR refresh and adjustment to reduce refresh latency and improve effective bandwidth;
- Four channels supported to increase performance by 40%;
- Rigorous solution to select high-quality chips only.


Specification parameters


Model 

X3

Specification

DDR4

Type

Desktop memory

Capacity

8GB/16GB/32GB

Appearance

Heatsink Memory

Packaging

Single Memory

Speed

2666MHz

3000MHz

3200MHz

Bandwidth

PC4   21300

PC4   24000

PC4   25600

Voltage

1.2V、1.35V(XMP)

Design

Follow DDR4 JEDEC 

Size

133.35mm*38mm*7.35mm (±0.15)